TechTaffy

tech:

taffy

Qualcomm bumps top smartphone chip in preparation for fall — Gizmodo

By TechTaffy Desk

The new Snapdragon 855 Plus features refreshed specs including new Qualcomm Kyro 485 Prime CPU cores with improved clock speeds, writes Sam Rutherford.

Here is the link: https://gizmodo.com/qualcomm-bumps-top-smartphone-chip-in-preparation-for-f-1836376345

Just in

Around the web

ChatGPT search tool vulnerable to manipulation and deception, tests show — The Guardian

OpenAI’s ChatGPT search tool may be open to manipulation using hidden content, and can return malicious code from websites it searches, a Guardian investigation has found; writes Nick Evershed. 
Public Sector

SAIC secures $170.9M cybersecurity contract with Texas Department of Information Resources

Science Applications International Corp. (SAIC) has been awarded a $170.9 million contract by the Texas Department of Information Resources (DIR) to provide cybersecurity services.
Series A

Infinant raises $15M

Charlotte, NC-based Infinant, a bank platform provider, has raised $15 million in a Series A funding round.
AI

Lockheed Martin partners with IBM to enhance AI tools for defense applications

Lockheed Martin is integrating IBM’s Granite large language models (LLMs) into its AI Factory.
IT

Zettabyte, Foxconn ink data center partnership

Zettabyte, a company specializing in AI data center software and infrastructure, has entered into a partnership with Hon Hai Technology Group (Foxconn).