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Qualcomm bumps top smartphone chip in preparation for fall — Gizmodo

By TechTaffy Desk

The new Snapdragon 855 Plus features refreshed specs including new Qualcomm Kyro 485 Prime CPU cores with improved clock speeds, writes Sam Rutherford.

Here is the link: https://gizmodo.com/qualcomm-bumps-top-smartphone-chip-in-preparation-for-f-1836376345

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