TechTaffy

tech:

taffy

GE Unveils New Rugged COM Express Module

By TechTaffy Desk

[Techtaffy Newsdesk]

GE Intelligent Platforms has unveiled the bCOM6-L1200 Rugged Type 6 COM Express Module. The bCOM6-L1200 is ideal for OEMs designing computing platforms into equipment for industrial or harsh environments, says GE.

By separating the carrier card from the processor, the bCOM6-L1200’s COM Express architecture extends the useful life of the subsystem by allowing upgrade of the processor alone. On-board components are specifically selected for their reliability in demanding conditions, and, unlike solutions designed for benign environments, processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.

[Image Courtesy: GE]

Just in

Series A

Tembo raises $14M

Cincinnati, Ohio-based Tembo, a Postgres managed service provider, has raised $14 million in a Series A funding round.
Around the web

Raspberry Pi is now a public company — TC

Raspberry Pi priced its IPO on the London Stock Exchange on Tuesday morning at £2.80 per share, valuing it at £542 million, or $690 million at today’s exchange rate, writes Romain Dillet. 
Fundings

AlphaSense raises $650M

AlphaSense, a market intelligence and search platform, has raised $650 million in funding, co-led by Viking Global Investors and BDT & MSD Partners.
Around the web

Elon Musk’s xAI raises $6B to take on OpenAI — VentureBeat

Confirming reports from April, the series B investment comes from the participation of multiple known venture capital firms and investors, including Valor Equity Partners, Vy Capital, Andreessen Horowitz (A16z), Sequoia Capital, Fidelity Management & Research Company, Prince Alwaleed Bin Talal and Kingdom Holding, writes Shubham Sharma. 
IT

Capgemini partners with DARPA to explore quantum computing for carbon capture

Capgemini Government Solutions has launched a new initiative with the Defense Advanced Research Projects Agency (DARPA) to investigate quantum computing's potential in carbon capture.