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DARPA Seeks Integration Of Microsystems Components On Chips

By TechTaffy Desk

[Techtaffy Newsdesk]

DARPA’s Diverse Accessible Heterogeneous Integration (DAHI) program is launching the DAHI Foundry Technology effort to advance novel methods for combining a variety of devices and materials onto a single silicon chip. This effort also seeks to enable complex signal-processing and self-correction architectures to be brought to bear. The DAHI Foundry Technology effort hopes to establish a foundry capability for the production of chips using a wide range of heterogeneously integrated devices.

 

High-performance microsystems are vital for a wide variety of DoD systems in areas such as communications, sensing and electronic warfare. Current fabrication technology limits the types of materials and devices that can be integrated together, forcing circuit designers to make compromises when selecting devices for an integrated microsystem, says DARPA.

“DARPA anticipates bringing the compound semiconductor and silicon integrated circuit (IC) communities together for new ways to integrate components onto a single silicon wafer,” explained Sanjay Raman, DARPA program manager. “Such convergence would enable foundry-style production of high-performance microsystems, leveraging today’s silicon IC manufacturing base.”

DAHI builds on the DARPA Compound Semiconductor Materials on Silicon (COSMOS) program, which focused on Indium Phosphide (InP) heterojunction bipolar transistor integration with silicon. COSMOS is now one of the DAHI program thrusts, along with Electronic-Photonic Heterogeneous Integration (E-PHI, which kicked off in November, 2011) and this new DAHI Foundry Technology effort.

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